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CITIZEN晶振研磨过程及蚀刻,CMR200T32768DZYT,小体积晶振,石英晶体谐振器

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 浏览：- 发布日期：2022-07-27 10:45:08【大 中 小】
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我们提供具有独特技术的超小型小体积晶振,高精度,高可靠性产品的集成生产,包括晶体碎片和包装.

脆性材料切割

当从合成石英切割石英晶振时,所获得的特性根据与晶面的角度而有很大不同.为了根据客户的要求获得晶体振荡器特性,我们将独特的创造力融入到使用线锯的加工技术中,并实现目标角度和厚度.

线锯切割是在高速往复细线和人造晶体之间供给和切割磨粒,与刀锯相比具有较小的切削余量,并且可以获得高生产率和加工精度.

切割

通过多年的手表零件加工培育的“精密切削”和“高精度切削”技术,即使在汽车精密零件中也展示了它们的能力,并获得了广泛的信心.我们正在积极挑战难以切割的材料,加工技术的发展也在不断改进.

CITIZEN晶振研磨过程及蚀刻,CMR200T32768DZYT,小体积晶振,石英晶体谐振器

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切割过程

线锯切割技术具有0.1至0.2毫米的极薄线径,因此几乎没有刮削,并且可以实现高生产率和高效率.

切割锯切割技术用作脆性材料晶片的切屑切割方法,支持曲线宽度为100μm或更小的批量生产,可实现高精度对准,高速和高精度切割.

脆性材料抛光

可以以高加工精度对晶片切割进行研磨和抛光处理,并使外部形状和厚度更加精确.

采用内部设计的工具并传承累积的技术,实现了高加工精度.在研磨中,我们采用双面抛光方法,提供高生产率,并提供满足客户需求的表面,从＃4,000表面处理到镜面抛光处理.

抛光

我们可以加工脆性材料晶振,主要是石英和陶瓷,厚度超薄,精度高,稳定供应.

CITIZEN晶振研磨过程及蚀刻,CMR200T32768DZYT,小体积晶振,石英晶体谐振器

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研磨过程

我们应对高精度外径精加工的磨削加工,无法应对切削.

我们的设备可以同时处理进料和进料研磨.

我们将通过与设备制造商的紧密合作,灵活应对复杂的加工形状.

此外,通过将石英坯料,薄膜磁头和光学玻璃加工中使用的单面和双面抛光技术应用于陶瓷材料,实现了高精度晶振.

塑料压制

塑料压制技术具有悠久的历史,迄今为止所培育的高科技被用于汽车精密零件的制造.我们擅长压制加工中精密小零件的批量生产,主要进行冲孔,斜孔加工,拉丝和压印加工.

电火花加工

采用EDM技术和公司制造的设备进行射孔加工,实现了横向孔加工,包括没有毛刺的变形孔

CITIZEN晶振研磨过程及蚀刻,CMR200T32768DZYT,小体积晶振,石英晶体谐振器

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蚀刻(石英)

蚀刻是一种利用化学品等腐蚀性物质处理材料的技术.

通过与光刻技术相结合,可以一次从石英晶片板形成大尺寸的小音叉型或AT石英晶体谐振器片.它还用于厚度调整,以调整AT石英晶体片的频率.

随着电子器件的小型化,石英振荡器的小型化也在不断发展,并且已经成为实现难以通过机械加工实现的小尺寸,高精度加工的必不可少的必要技术.

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蚀刻

这是一种利用氢氟酸等化学物质的腐蚀作用处理材料的技术.它已成为通过研磨或实现小型,高精度石英晶振加工所获得的表面改性所必需的必要技术,这种加工难以通过加工实现.

研磨工艺

在上板和下板之间的两侧同时抛光晶片,实现高去除效率和加工精度.

另外,通过双面研磨不能处理的极小部件可以粘合到夹具上并通过单面研磨以高精度加工.

磨料布附着在上下表面板的加工表面上,同时在两侧同时用更细的磨粒抛光,以完成极其光滑的镜面.

另外,可以将通过双面抛光不能处理的极小部件粘合到夹具上并通过单面抛光进行镜面抛光.

CITIZEN晶振研磨过程及蚀刻,CMR200T32768DZYT,小体积晶振,石英晶体谐振器

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【本文标签】：CITIZEN晶振研磨过程及蚀刻 CMR200T32768DZYT 小体积晶振 石英晶体谐振器
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