频率:6.000MHz
尺寸:7.0x5.0mm
Rakon瑞康晶振,QESM01110HQ30206.000MHz,无线通信6G晶振 参数表
Parameter
Min
Typ
Max
Unit
Test condition / Description
Nominal frequency (Fn)
6
MHz
Calibration tolerance
±10 to
±50
ppm
Frequency at 25°C ± 2°C and
specified load capacitance
Reflow shift
±1
ppm
Frequency shift after reflow with 4
hours settling at 25°C
Operating temperature range
-20 to 70
-40 to 85
°C
Refer to ordering information
Storage temperature range
-40
+85
°C
Frequency stability
over temperature
±10 to
±50
ppm
Referenced to frequency reading at
25°C and the specified load
capacitance
Long-term stability (Ageing)
±2
ppm
Frequency drift over 1 year at 25°C
Shunt capacitance (CO)
7.0
pF
Load capacitance (CL)
10
32
pF
Refer to ordering information
Drive level
10
100
500
µW
Equivalent series resistance (ESR)
6.000 to 7.999MHz
8.000 to 15.999MHz
16.000 to 39.999MHz
40.000 to 83.999MHz
84.000 to 100.000Mhz
100
60
40
70
60
Ω
Mode of vibration:
Fundamental (AT-cut)
Fundamental (AT-cut)
Fundamental (AT-cut)
3rd Overtone (AT-cut)
3rd Overtone (AT-cut)
Insulation resistance (IR)
500
MΩ
100 V ±15 V at 25°C
Rakon瑞康晶振,QESM01110HQ30206.000MHz,无线通信6G晶振 尺寸图
Rakon瑞康晶振,QESM01110HQ30206.000MHz,无线通信6G晶振
小型贴片石英晶振主要采用了,先进的晶片的抛光工艺技术,是晶体行业中石英晶片研磨技术中表面处理的最高技术,最终使晶片表面更光洁,平行度及平面度更好,大大的降低谐振电阻,使精度得到了很大的提升。改变了传统的生产工艺,使产品在各项参数得到了很大的改良,外观尺寸具有薄型表面贴片型石英晶体谐振器,特别适用于有小型化要求的市场领域,比如智能手机,无线蓝牙,平板电脑等电子数码产品。

SG-310SCF25.00MHzL,EPSON振荡器,25MHz晶振,采用3.2×2.5mm小型化贴片规格,体积小巧,布局灵活,适配设备轻薄化设计需求.标准四脚无铅封装完美兼容全自动SMT高速贴装与回流焊工艺,焊接性能稳定,耐高温,不易虚焊脱焊,批量生产良率极高,有效降低量产返工成本.作为成熟通用型有源晶振,无需外围辅助电路,起振速度快,批次一致性高,彻底解决量产设备时序不稳,参数偏差等常见问题.产品功耗低,运行稳定,适配智能家居,数码电子,无线传感,小型工控设备等大批量生产场景.我司渠道纯正,交期稳定,支持小批量打样,大批量长期供货,一站式元器件配套服务,欢迎来电0755-27876201洽谈合作.

