Bliley石英SMD晶振,6G无线晶振,BQCSC-50M3-DCBAT，尺寸5.00x3.20mm，频率50MHZ，美国Bliley晶振，进口百利晶体，liley Crystal，轻薄型晶体，石英贴片晶振，石英晶体谐振器，石英贴片晶振，SMD晶振，无源石英晶体，小型设备晶振，仪器设备晶振，6G无线晶振，智能音响晶振，娱乐设备晶振，智能手机晶振，小型设备晶振，便携式设备专用晶振，通讯产品专用晶振，网络设备晶振，智能家居晶振，四脚贴片晶振，高性能石英晶振，高品质无源晶振，低功耗晶振，具有良好的耐压性能以及稳定性能。
晶振外观使用金属材料封装的,具有高稳定性,高可靠性的石英无源晶体,晶振外观本身使用金属封装,充分的密封性能,可确保其高可靠性,采用编带包装,外包装采用朔胶盘,可在自动贴片机上对应自动贴装等优势.Bliley石英SMD晶振,6G无线晶振,BQCSC-50M3-DCBAT.
Bliley石英SMD晶振,6G无线晶振,BQCSC-50M3-DCBAT 参数表
| Parameter | ConditionsFundamental3rdovertoneUnit | |||||||||||||||||||
| Frequency Range | 10.0 – 60.040.0 – 150.0MHz | |||||||||||||||||||
| Frequency Tolerance | @ + 25℃±50 Max (see options)ppm | |||||||||||||||||||
| Frequency Stability | ±100 Max (see options)ppm | |||||||||||||||||||
| Aging | Max 1stYear±3.0ppm | |||||||||||||||||||
|
Equivalent Series Resistance (max) |
8.0 – 12.0 MHz100Ω | |||||||||||||||||||
| 13.0 – 20.0 MHz80Ω | ||||||||||||||||||||
| 20.0 – 29.0 MHz50Ω | ||||||||||||||||||||
| 30.0 – 60.0 MHz40Ω | ||||||||||||||||||||
| 40.0 – 150.0 MHz80Ω | ||||||||||||||||||||
| Insulative Resistance | Min @ 100Vdc ±15Vdc500MΩ | |||||||||||||||||||
| Drive Level | 10 Typ, 200 MaxμW | |||||||||||||||||||
| C0 (Shunt Capacitance) | Max5.0pF | |||||||||||||||||||
| CL (Load Capacitance) | Per Option (typical)6-20 (see options)pF | |||||||||||||||||||
| DLD | 50nW to 100µW±10 Maxppm | |||||||||||||||||||
| RLD | 50nW to 100µW20% MaxΩ | |||||||||||||||||||
| Operating Temp Range | -20 to +70 / -40 to +85℃ | |||||||||||||||||||
| Storage Temp Range | -55 to +125℃ | |||||||||||||||||||
| Sealing Method | Seam Weld | |||||||||||||||||||
| Moisture Sensitivity Level | 1 | |||||||||||||||||||
Bliley石英SMD晶振,6G无线晶振,BQCSC-50M3-DCBAT 尺寸图
贴片晶振产品特征:
SMD结构
标准5.0x3.2mm毫米包装尺寸
整个温度范围内的高稳定性
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